ASME Utah Presents: Embedded Microfluidic Cooling - Gen3 Thermal Packaging Technology
Avram Bar-Cohen, Ph.D. Program Manager, Microsystems Technology Office Defense…
Historic EPA Now Signed with U of U
HILL AIR FORCE BASE, UT – An agreement 25 years in the making was signed June…
Innovative Mechanical Engineering MS/MBA Program Begins Fall 2009
Beginning Fall 2009 the University of Utah is offering a new dual degree…
World Haptics Conference
The University of Utah was selected to host the 2009 World Haptics Conference…